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Chapter 7 - Low Temperature Wafer Direct Bonding. 67. Chapter 8 - How much does ion-cut cost? 74. Chapter 9 - Is MonolithIC 3D-IC less risky than scaling or TSV? ... Chapter 18 – Monolithic 3D IC Could Increase Circuit Integration by 1,000x ... His vision led to the invention of the first Structured ASIC architecture, the first ...
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Three-Dimensional Integration: A More Than Moore Technology
Abstract Three-dimensional integrated circuits (3D-ICs), which contain multiple ... monolithic substrate enhances the overall speed of the system, while .... Nobel Laureate in Physics, William Shockley invented TSVs more than 50 years ago ... wafer-to-wafer and die-to wafer stacking techniques for the fabrication of devices.
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3-D Hyperintegration and Packaging - Rensselaer Polytechnic Institute
Mar 1, 2009 ... hyperintegration and packaging technologies, including moti- vations, key ... Indeed, 3-D integration is re- cognized as an .... Monolithic wafer-level BEOL- compatible 3-D hyper- integration ..... Jack Kilby invented the integrated circuit (IC ) in 1958 at ..... A. Kaloyeros, BA wafer-scale 3D IC technology platform ...
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Monolithic Concept and the Inventions of Integrated Circuits by Kilby
May 24, 2007 ... the current stage of Ultra Large Scale ICs (ULSICs) and beyond. ... regarded as the inventor of ICs, implying monolithic-ICs, .... This erroneous characterization was re-stated on p. 26 .... each fabrication step is done on the wafer as a whole, i. e., ..... Law for the 2D-ICs can be removed by invoking the 3D-ICs.
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Testing of 3-D Stacking Devices
May 11, 2012 ... Techniques for 3D Integrated Circuits ... Drivers for 3D Integra$on, Stacked 3D ICs (“SICs”), Benefits ... Wafer thinning, TSV forma$on, alignment/bonding. • 3D ... source: http://www.monolithic3d.com/2/post/2011/4/who-invented-3d-stacking. html ... Monolithic 3D .... Rapid assembly (wafer-scale economics).
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Revolutionary and Evolutionary Innovations in Thermal - Meptec
Nov 10, 2011 ... inventing. No idea will ... between iC packaging and systems are ... suppliers of wafer, assembly, mems and ... 2.5D, 3D and Beyond. Bringing 3D Integration to the Packaging Mainstream ... semiconductors through device scaling is decreasing ...... Jeanne Beacham was re- ... the new 20nm monolithic.
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Enabling a multiple processor SiP with 2.5D TSVs - Chip Scale
The International Magazine for Device and Wafer-level Test, Assembly, and Packaging. Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS,. MOEMS ...... that can be invented has been invented.” .... drive a trend for monolithic integration .... re-use, and reduced program risk are.
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System Interconnection Design Trade-offs in Three - DiVA
Through silicon via (TSV) based 3-D wafer-level integration is an emerging ... PhD studies. Their constant enthusiasm for learning, and finding new re- search avenues is ... Zheng, ”Modelling Through-Silicon-Vias in 3D-ICs,” IET Electronic Letters, ..... the invention of the transistor, monolithic concept and the planar process.
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Wireless Interconnect using Inductive Coupling in 3D-ICs by Sang
3DIC can increase integration density after planar CMOS process. ... Wireless wafer level tester using capacitive coupling (a) head plate open (b) ...... monolithic integrated circuit (IC), the integration of a large numbers of tiny transistors ... better performance than wire-bonding, but it requires an additional re-distribution layer.
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Microengineering Aerospace Systems
surement systems, as well as the actual automation facilities used in IC ... phragms were fabricated) to a base wafer in the 1970s, allowing wafer-scale ... The first monolithic integrated pressure sensor with digital (i.e., frequency) output was ..... for fabrication of 3D structures.14 Bulk micromachining of Si uses wet- and ...
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Ge-Photodetectors for Si-Based Optoelectronic Integration - MDPI
Jan 12, 2011 ... Monolithic integration of an array of eight polycrystalline Ge pixels with CMOS readout ... In the early stage of crystalline Ge film epitaxy on Si wafers, ..... 3D view of the PIN Ge photodiode with 49 GHz bandwidth. .... high-gain CMOS IC. ..... Assefa, S.; Xia, F.; Vlasov, Y. Reinventing germanium avalanche ...
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Dec 9, 2013 ... Normalized Energy. Operation. Monolithic 2.5D/3D ... An 8192-Point Fast Fourier Transform 3D-IC Case Study, R. Davis, A. Sule, and P. Franzon ... Thin wafer handling & processing ... considerations are now part of 2.5D/3D integration ... Reinventing the ... Memory Bandwidth Scaling Trends and System.
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PDF Full-text - MDPI
Jan 21, 2016 ... integrate MEMS structures with integrated circuits (IC) on a single CMOS ... One of the best-known commercial monolithic CMOS-MEMS ... in pre-CMOS integration . re 2. Die photo of a 3-axis accelerometer ... In wafer fabrication, sensor polysilicon thin films deposition and .... 1989 (invented in 1987).
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international directory of test & burn-in socket - Advantage Inc
Chip Scale Review January • February • 2016 [ChipScaleReview.com]. CONTENTS ... The International Magazine for Device and Wafer-level Test,. Assembly, and .... is a 3D IC memory and logic stack using ... re e e m er l u l er. l e C e m er l e , emer e e o e . e e , ... use of 3D system integration schemes.
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Page 1 THE PROTECTION OF PIONEER INNOVATIONS
tionally based on silicon dies (wafers) on which the developer “prints” .... ments. 17 Kilby invented the concept of the monolithic integrated circuit ... the IC industry flourished from the beginning; it allowed young start- .... the Bell licensing model ( see below) and sent thousands of Japanese re- ..... up economies of scale.”.
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Lessons Learnt from the Semiconductor Chip Industry and its IP Law
tionally based on silicon dies (wafers) on which the developer “prints” .... ments. 17 Kilby invented the concept of the monolithic integrated circuit ... the IC industry flourished from the beginning; it allowed young start- .... the Bell licensing model ( see below) and sent thousands of Japanese re- ...... 195 F.3d 1346, 1349 (Fed.
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Semiconductor, innovation and intellectual property - WIPO
tion (airplanes, antibiotics, semiconductors, 3D printing, nanotechnology and robotics). ... Indeed, the invention of integrated circuits (ICs) was one of the main ... The circuits are put on the wafer by specially created patterns, the masks. ..... Kilby had invented the monolithic integrated circuit by linking diodes, transis-.
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Emerging Business Trends in the Microelectronics Industry
Jan 19, 2016 ... As the integrated circuit technology approaches its ultimate scaling limit, the different ... evolving since the invention of integrated circuits (ICs) in the year 1958  . .... foundry business model, the foundries - provide only wafer fabrication ... (DFM refers to design for manufacturing and CRM re-.
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1986 Annual Report - Semiconductor Research Corporation
integrated program of basic research ... wafers into an ion implanter at North .... Monolithic Memories, Incorporated ... invention of the transistor four decades earlier. ... BOARD (TAB) is the SRC's major re- .... facturable IC systems which achieve .... 2D and 3D structures. .... Ultra-Large-Scale Integrated Processing Equipment.
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More than Moore - International Technology Roadmap for
that do not necessarily scale according to "Moore's Law“. Given the ... 1954, five years before the integrated circuit was invented, the average selling price of a .... System-in-package. (SiP). More than Moore: Diversification. M o re M .... technologies (e.g. for 3D integration of multiple chips), manufacturing techniques (e.g. ...
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